PU含浸拋光墊

主要用於軟拋製程，依照纖維之織法及PU的含量可依照密度區分為三種等級，可搭配不同的開溝法來設計不同拋光效能之表層。
可撘配不同的拋光液使用，適合於：光電元件( Sapphire, Si wafer…)、玻璃元件軟拋、金屬元件軟拋…，主要為拋光製程中增進平坦度、去除刮傷重要的製程。

Primarily used in soft polishing processes, PU-impregnated polishing pads are classified into three density grades, determined by the weaving method of the fibers and the polyurethane (PU) content. Various groove patterns can be applied to tailor the surface for specific polishing performance.

These pads are compatible with different polishing slurries and are ideal for soft polishing applications involving optoelectronic components (such as Sapphire and Silicon wafers), glass components, and metal parts. They play a key role in improving surface flatness and removing scratches, making them an essential part of precision polishing processes.