氧化矽拋光液

FSP系列拋光液是由高純度的膠態氧化矽微粒(colloidal silica)所組成，依照不同的粒徑可區分為三個等級，適用於矽晶圓、石英晶體、藍寶石、鋰酸鈮、鉭酸鈮、合金金屬…元件的拋光使用。

The FSP series polishing slurry is composed of high-purity colloidal silica particles. It is available in three grades based on particle size, and is suitable for polishing a variety of components including silicon wafers, quartz crystals, sapphire, lithium niobate, tantalum niobate, and alloy metals.