氧化矽拋光液
Silicon Oxide Polishing Compound
FSP系列拋光液是由高純度的膠態氧化矽微粒(colloidal silica)所組成,依照不同的粒徑可區分為三個等級,適用於矽晶圓、石英晶體、藍寶石、鋰酸鈮、鉭酸鈮、合金金屬…元件的拋光使用。
The FSP series polishing slurry is composed of high-purity colloidal silica particles. It is available in three grades based on particle size, and is suitable for polishing a variety of components including silicon wafers, quartz crystals, sapphire, lithium niobate, tantalum niobate, and alloy metals.
製品名 Product |
FSP-050 |
FSP-080 |
FSP-100 |
Content of SiO2(%) |
40 |
40 |
40 |
pH |
10.2 |
10.2 |
10.2 |
Specific Gravity |
1.3 |
1.3 |
1.3 |
Particle Size(nm) |
45 |
75 |
100 |
Package |
25KG |
25KG |
25KG |
雙田國際有限公司|電話:+886-3-6682257|傳真:+886-3-6685722|地址:307005 新竹縣芎林鄉五龍村2鄰五和街232之1號|電郵:fd92@futada.com.tw |