■ LSL 系列是專為雷射切割而開發的。
LSL Series are specially developed for laser cutting.

■ 可以在雷射加工之前旋塗到晶圓表面，以減少碎片（加工切屑）沾附。
It is able to be spin-coated to the wafer surface before laser processing to reduce debris (machining chips) adhesion.

■ 減少了過度加熱和燒毀異常發生，可提高了製程可靠性。
Improve reliability of the process and reduce overheating and burning.

■ 產品具有優異的潤濕性，有助於滲透進入 pattern，並達到覆蓋均勻性。
The product has excellent wetting ability, which helps penetrate into the pattern to achieve coverage uniformity.

■ 具有水溶性。
Good water solubility.

■ LSL 系列在雷射加工後可用純水去除。
LSL Series can be easily removed with pure water.

■ 減少製程的碎屑，提升製程能力以及可靠性。
Reduce processing scrap, increase the process ability and reliability.