
主要是各式基板減薄專用高效率減薄墊,採用先進科學方法將鑽石粉末與複合式材料調配出的高效率研磨拋光產品。主要應用在需要有高效率、高精密要求的平面研磨制程。目前廣泛應用於手機蓋板玻璃。
It is mainly an efficient thinning pad for thinning various substrates. It uses advanced scientific methods to efficiently mix diamond powder and composite materials. It is mainly used in surface grinding processes that require high efficiency and precision. Widely used in mobile phone cover glass
■ 具有非常高的研磨效率和研磨精準度
High grinding efficiency and precision
■ 高度統一的品質再現性
Highly consistent quality reproducibility
■ 廣泛的機臺適用性
Applicable to all kinds of equipment
| 手機蓋板 Cover Glass | 光纖玻璃 Optical fiber glass |
| 玻璃碟片 Glass Discs | 光學 /液晶玻璃 Optical / LCD glass |
| 半導體基板 Semiconductor wafer / SiC , AlN , Si3N4 | |
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雙田國際有限公司
FUTADA International Co., Ltd.
電話:+886-3-6682257 | 傳真:+886-3-6685722
地址:307005 新竹縣芎林鄉五龍村2鄰五和街232之1號
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