研磨拋光治具 Carrier
材質：
玻璃纖維板，藍鋼片，不鏽鋼片，Aramid 板，PVC 及其他各 種材料 可生產尺寸：最大可到直徑1500mm，最薄可到0.2mm
Materials:
Fiberglass board, blue steel plate, stainless steel plate, aramid board, PVC, and various other materials.
Available Sizes:
Maximum diameter up to 1500 mm; minimum thickness as thin as 0.2 mm.
客製化生產：
可依機台使用狀況作規格上的微調 可配合多種工件研磨，包括:矽片、石英晶片、光學玻璃、陶瓷片、 鈮酸鋰、藍寶石片、晶圓等硬脆材料，或非金屬的雙面研磨或拋光 。
Customized Production:
Specifications can be fine-tuned based on machine compatibility.
Suitable for grinding and polishing a wide range of workpieces, including: silicon wafers, quartz wafers, optical glass, ceramic substrates, lithium niobate, sapphire wafers, and other hard and brittle materials, as well as double-sided grinding or polishing of non-metal materials.
玻璃纖維板，藍鋼片，不鏽鋼片，Aramid 板，PVC 及其他各 種材料 可生產尺寸：最大可到直徑1500mm，最薄可到0.2mm
Materials:
Fiberglass board, blue steel plate, stainless steel plate, aramid board, PVC, and various other materials.
Available Sizes:
Maximum diameter up to 1500 mm; minimum thickness as thin as 0.2 mm.
客製化生產：
可依機台使用狀況作規格上的微調 可配合多種工件研磨，包括:矽片、石英晶片、光學玻璃、陶瓷片、 鈮酸鋰、藍寶石片、晶圓等硬脆材料，或非金屬的雙面研磨或拋光 。
Customized Production:
Specifications can be fine-tuned based on machine compatibility.
Suitable for grinding and polishing a wide range of workpieces, including: silicon wafers, quartz wafers, optical glass, ceramic substrates, lithium niobate, sapphire wafers, and other hard and brittle materials, as well as double-sided grinding or polishing of non-metal materials.
產品介紹 Product
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